Dr. Chia-Shy Chang, CEO & President
The automotive industry is advancing and developing at an exponential pace. As the four major trends of connected, autonomous, shared, and electric driving continue to shape the future of mobility, the organizations are inclined toward more flexible, compatible, and individualized solutions that align with the latest innovations in this field. With the aim to realize the concept of autonomous driving, auto OEMs are tapping into the benefits of Level 2 (L2/L2+) Advanced Driver-Assistance Systems (ADAS) and L3 ADAS to identify and track potential hazards and further ease driving. Digital imaging also plays an instrumental role in achieving the goal of auto safety, driving assistance, and driving comfort. In the same vein, the automotive image sensors have been widely applied to viewing applications such as 360-degree surround view to sensing applications that the powerful processors compute and sense the realtime driving environment to achieve totally safe driving based on the image data of the sensors. Compared with the viewing applications, the requirements on sensors for sensing applications, such as high resolution, HDR, LFM, high low light sensitivity, tighter reliability, and more, have become more stringent. Moving forward, the trend of the sensor designs will be bigger in size and stack-die, and at the same, it requires adept packaging which can provide higher reliability of AEC Q-100 TCT-2000 cycles than the conventional TCT 1000 cycles.
Set against this rapidly evolving backdrop, if there’s one company that can be truly credited for the advancement of automotive CIS packaging, it’s KINGPAK Technology. A leading name in automotive CIS packaging, KINGPAK Technology specializes in mass production of automotive CIS packaging since 2010 and proudly owns more than 50 percent market share today. With more than 300 million units shipments with marketverified high quality, KINGPAK Technology has accumulated the market verified experiences through the advanced and patented tiny iBGA/ im2BGA technologies for automotive ADAS CIS of high resolution.
“KINGPAK Technology has been pursuing the goal of zero defect by improving the packaging technology and process and comply the IATF 16949 and VDA6.3. We are committed to providing the continuous evolutionary automotive package service including the technology and product quality toward the goal of zero defect,” says Dr. Chia-Shy Chang, CEO & President, KINGPAK Technology.
KINGPAK Technology is a 100 percent subsidiary of Tong Hsing Electronics Industries, Ltd. (THEIL), which is the leader of CIS wafer reconstruction. THEIL is one of the Yageo group members, which is a leading global electronic component company offering its complete product portfolio of resistors, capacitors, wireless, and circuit protection components to meet the diverse requirements from consumer, communication, industrial, medical, automotive, and aerospace applications. This acquisition has expanded the synergy of technology sharing and advancement in the CIS platform. KINGPAK Technology has gradually transferred the wafer reconstruction business to THEIL and focusing on advanced packaging for automotive and security applications. This synergy also allows KINGPAK Technology to empower its customers with final test service to complete the package and testing at the same place to save transportation time and costs.
At the core, KINGPAK Technology leads the niche CIS (CMOS Image Sensor) micro packaging field by offering automotive image sensors, along with consumer products, wearable products, safety monitoring, and automobile-related CIS packaging, as well as video testing services. With a strong foundation in autonomous micro and thin packaging technology, the company leverages its car image sensor technology capability to develop new packaging technology that is thinner and lighter, provides high reliability and cost competitiveness in order to meet market requirements. At the same time, KINGPAK Technology is also developing the Far Infrared Sensor (FIR Sensor), Time of Flight Sensor (ToF Sensor), and other automobile-related packaging technology in preparation for the rapidly maturing market.
KINGPAK Technology prides itself on the corporate motto of “constant determination and striving for improvement” and aims to continue providing “the right direction, instantaneous speed, and impeccable implementation” in order to deliver better products, services, and turn-key solutions. While the key patents for tiny iBGA and im2BGA make KINGPAK Technology an indisputable leader in this realm, the company also marks its uniqueness by meeting the diverse requirements of its large-scale clients through high quality and delivery services. Moreover, the company also ensures that its customers have 24/7 support available to solve urgent issues found on the sensors. This round-the-clock, proactive service has been instrumental during the Covid-19 period, allowing KINGPAK Technology to support its customers and Tier-1 companies located across the U.S. and Europe. Evidently, the continuous efforts on supporting the clients across the widespread timezones have contributed to impressive results and gained appreciation from customers and Tier-1 companies. “We will keep providing the best service to enhance our value proposition and our customers’ benefits. From the technology perspective, iBGA/ im2BGA technologies are currently the best solutions to automotive CIS package while we are also developing advanced technologies to deal with the potential problems caused by the new trends of sensor designs toward autonomous driving,” adds Dr. Chia- Shy Chang.
Needless to say, most of the top automotive CIS vendors rely on KINGPAK Technology for the value it brings to the table.